NXP Semiconductors
BAS21AVD
High-voltage switching diodes
12. Package outline
3.1
2.7
6
5
3.0 1.7
2.5 1.3
pin 1 index
1.1
0.9
4
0.6
0.2
1
2
0.95
1.9
Dimensions in mm
Fig. 8. Package outline TSOP6 (SOT457)
3
0.40
0.25
0.26
0.10
04-11-08
13. Soldering
3.45
1.95
0.95
3.3 2.825
0.95
0.45 0.55
(6×) (6×)
0.7
(6×)
0.8
(6×)
2.4
Fig. 9. Reflow soldering footprint for TSOP6 (SOT457)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot457_fr
BAS21AVD
Product data sheet
All information provided in this document is subject to legal disclaimers.
1 August 2013
© NXP N.V. 2013. All rights reserved
6 / 11