UPD72850A Просмотр технического описания (PDF) - NEC => Renesas Technology

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UPD72850A

IEEE1394 400Mbps PHY

NEC => Renesas Technology 

µPD72850A

9. RECOMMENDED SOLDERING CONDITIONS

The µPD72850A should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales

representative.

Table 9-1. Surface Mounting Type Soldering Conditions

µPD72850AGK-9EU : 80-pin plastic TQFP (Fine pitch) (12 x 12 mm)

Soldering

Soldering Conditions

Recommended

Method

Condition Symbol

Infrared reflow

Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher).

Count: three times or less

Exposure limit: 3 daysNote (after that prebake at 125°C for 10 hours)

IR35-103-3

Partial heating Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row)

—

Note After opening the dry pach, store it at 25°C or less and 65% RH or less for the allowable storage period.

46

Data Sheet S14452EJ1V0DS00

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