TLP112A
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Forward current
Pulse forward current
Peak transient forward current
Reverse voltage
Output current
Peak output current
Supply voltage
Output voltage
Output power dissipation
Operating temperature range
Storage temperature range
Lead soldering temperature(10s)
Isolation voltage
(AC, 1min., R.H.≤ 60%,
(Note 1)
(Note 2)
(Note 3)
(Note 4)
Symbol
IF
IFP
IFPT
VR
IO
IOP
VCC
VO
PO
Topr
Tstg
Tsol
Note 5)
BVS
Rating
20
40
1
5
8
16
−0.5~15
−0.5~15
100
−55~100
−55~125
260
2500
Unit
mA
mA
A
V
mA
mA
V
V
mW
°C
°C
°C
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 1) Derate 0.36mA / °C above 70°C.
(Note 2) 50% duty cycle, 1ms pulse width.
Derate 0.72mA / °C above 70°C.
(Note 3) Pulse width ≤ 1μs, 300pps.
(Note 4) Derate 1.8mW / °C above 70°C.
2
2007-10-01