CS48DV2B(2008) Просмотр технического описания (PDF) - Cirrus Logic

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CS48DV2B
(Rev.:2008)

32-bit Audio DSP for Dedicated Dolby Volume and Audistry by Dolby

Cirrus Logic 

CS48DV2B Data Sheet

32-bit Audio DSP for Dedicated Dolby Volume and Audistry by Dolby

5.4 Power Supply Characteristics

(Measurements performed under operating conditions)

Parameter

Operational Power Supply Current:

VDD: Core and I/O operating1

VDDA: PLL operating

VDDIO: With most ports operating

Total Operational Power Dissipation:

Min

Typ

Max

Unit

-

203

-

mA

-

8

-

mA

-

27

-

mA

480

mW

Standby Power Supply Current:

VDD: Core and I/O not clocked

VDDA: PLL halted

VDDIO: All connected I/O pins 3-stated by other ICs in system

T Total Standby Power Dissipation:

F 1. Dependent on application firmware and DSP clock speed.

-

100

-

μA

-

1

-

μA

-

50

-

μA

-

348

-

μW

A 5.5 Thermal Data (48-Pin LQFP)

Parameter

Symbol Min

Typ

Max

Unit

R Thermal Resistance (Junction to Ambient)

Two-layer Board1 θja

D Four-layer Board2

-

63.5

-

°C / Watt

-

54

-

Thermal Resistance (Junction to Top of Package)

L I Two-layer Board3 ψjt

Four-layer Board4

-

0.70

-

°C / Watt

-

0.64

-

IA H 1. Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20 % of the top &

bottom layers.

T P 2. Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20 % of the top &

bottom layers and 0.5-oz. copper covering 90 % of the internal power plane & ground plane layers.

N L 3. To calculate the die temperature for a given power dissipation

E E T q j = Ambient Temperature + [ (Power Dissipation in Watts) * ja ]

4. To calculate the case temperature for a given power dissipation

CONFID D T T c = j - [ (Power Dissipation in Watts) * yjt ]

DS875F1

Copyright 2008 Cirrus Logic

11

CONFIDENTIAL

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