TMP47C102M Просмотр технического описания (PDF) - Toshiba
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TMP47C102M Datasheet PDF : 48 Pages
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Quality and Reliability Assurance / Handling Precautions
Table 2.4 Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (2/2)
Products
Name
TMP90PH48F
TMP91P642F
TMP91C642AF
TMP90PM42F
TMP90PM42DF
TMP90CH42F
TMP90CH42DF
TMP90CK42F
TMP90CK42DF
TMP90PS74DF
TMP90CM36T
TMP90CM37T
TMP90PM36T
TMP90CM38T
TMP90CM39T
TMP90PM38T
TMP90CS36T
TMP90CS37T
TMP90PS36T
TMP90CS38T
TMP90CS39T
TMP90PS38T
Package no.
P-QFP80-1420-0.80B
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP100-2222-0.80A
P-QFP100-1420-0.65A
P-QFP100-2222-0.80A
P-QFP100-1420-0.65A
P-QFP100-2222-0.80A
P-QFP100-2222-0.80A
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
Air reflow
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
Infrared reflow
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
Note 1: As of September, 2001
Note 2: Ensure that the conditions for top/bottom heating using the
long/medium infrared reflow method are strictly adhered to, even when
this method is used in combination with the air reflow method.
Note 3:
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
030901
QUA-13
2002-02-20
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