MPXV7002(2005) Просмотр технического описания (PDF) - Freescale Semiconductor

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MPXV7002
(Rev.:2005)

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing a gel die coat which

protects the die from harsh media.

The Pressure (P1) side may be identified by using the

table below:

Part Number

MPXV7002GC6U/GC6T1

MPXV7002GP

MPXV7002DP

Case Type

482A-01

1369-01

1351-01

Pressure (P1)

Side Identifier

Vertical Port Attached

Side with Port Attached

Side with Dual Port Attached

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

footprint, the packages will self align when subjected to a

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

between the board and the package. With the correct

shorting between solder pads.

0.660

16.76

0.100 TYP 8X

2.54

0.060 TYP 8X

1.52

0.300

7.62

0.100 TYP 8X

2.54

inch

mm SCALE 2:1

Figure 5. Small Outline Package Footprint

MPXV7002

4

Sensors

Freescale Semiconductor

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