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MPVZ5004G6U

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

-A-

5

-B-

8

S

N

J

K

PACKAGE DIMENSIONS

Pressure

D 8 PL

4

0.25 (0.010) M T B S A S

G

1

C

M

PIN 1 IDENTIFIER

H

-T-

SEATING

PLANE

CASE 482-01

ISSUE O

SMALL OUTLINE PACKAGE

SURFACE MOUNT

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

INCHES

DIM MIN MAX

A 0.415 0.425

B 0.415 0.425

C 0.212 0.230

D 0.038 0.042

G 0.100 BSC

H 0.002 0.010

J 0.009 0.011

K 0.061 0.071

M 0˚

7˚

N 0.405 0.415

S 0.709 0.725

MILLIMETERS

MIN MAX

10.54 10.79

10.54 10.79

5.38 5.84

0.96 1.07

2.54 BSC

0.05 0.25

0.23 0.28

1.55 1.80

0˚

7˚

10.29 10.54

18.01 18.41

-A-

5

N -B-

8

S

J

K

D 8 PL

4

0.25 (0.010) M T B S A S

G

1

V

C

M

W

PIN 1 IDENTIFIER

H

-T-

SEATING

PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

INCHES

DIM MIN MAX

A 0.415 0.425

B 0.415 0.425

C 0.500 0.520

D 0.038 0.042

G 0.100 BSC

H 0.002 0.010

J 0.009 0.011

K 0.061 0.071

M 0˚

7˚

N 0.444 0.448

S 0.709 0.725

V 0.245 0.255

W 0.115 0.125

MILLIMETERS

MIN MAX

10.54 10.79

10.54 10.79

12.70 13.21

0.96 1.07

2.54 BSC

0.05 0.25

0.23 0.28

1.55 1.80

0˚

7˚

11.28 11.38

18.01 18.41

6.22 6.48

2.92 3.17

CASE 482A-01

ISSUE A

SMALL OUTLINE PACKAGE

SURFACE MOUNT

Sensors

Freescale Semiconductor

MPXV5004G

7

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