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MMG3002NT1 Просмотр технического описания (PDF) - Freescale Semiconductor

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MMG3002NT1 Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
1.7
3.48
5.33
1.27
0.58
0.86
0.64
3.86
Recommended Solder Stencil
7.62
0.305 diameter
2.49
1.27
2.54
NOTES:
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
USED IN PCB LAYOUT DESIGN.
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL
AND RF PERFORMANCE.
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM
PITCH.
Figure 23. Recommended Mounting Configuration
RF Device Data
Freescale Semiconductor, Inc.
MMG3002NT1
11
 

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