MAX15003 Просмотр технического описания (PDF) - Maxim Integrated

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MAX15003

Triple-Output Buck Controller with Tracking/Sequencing

Maxim Integrated 

MAX15003

Triple-Output Buck Controller with

Tracking/Sequencing

ABSOLUTE MAXIMUM RATINGS

IN, LX_, CSN_ to SGND..........................................-0.3V to +30V

BST_ to SGND ........................................................-0.3V to +30V

BST_ to LX_ ..............................................................-0.3V to +6V

REG, DREG_, SYNC, EN_, RT, CT,

RESET, PHASE, SEL to SGND ...............................-0.3V to +6V

ILIM_, PGOOD_, FB_, COMP_, CSP_ to SGND .......-0.3V to +6V

DL_ to PGND_.......................................-0.3V to (VDREG_ + 0.3V)

DH_ to LX_ ...............................................-0.3V to (VBST_ + 0.3V)

PGND_ to SGND, PGND_ to Any Other PGND_.......-0.3V to +0.3V

Continuous Power Dissipation (TA = +70°C)

48-Pin TQFN (derate 38.5mW/°C above +70°C) .......3076.9mW*

Operating Junction Temperature Range ...........-40°C to +125°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-60°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

*As per JEDEC51 standard (multilayer board).

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

48 TQFN

Junction-to-Ambient Thermal Resistance (θJA)...............26°C/W

Junction-to-Case Thermal Resistance (θJC)......................1.3°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

ELECTRICAL CHARACTERISTICS

(VIN = 5.5V to 23V or VIN = VREG = 4.5V to 5.5V, VDREG_ = VREG, VPGND_ = VSYNC = VPHASE = VSEL = 0V, CREG = 2.2µF, RRT =

100kΩ, CCT = 0.1µF, RILIM_ = 60kΩ, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at VIN = 12V and TA = TJ

= +25°C, unless otherwise noted.) (Note 1)

PARAMETER

SYSTEM SPECIFICATIONS

Input Voltage Range

Input Undervoltage Lockout

Threshold

SYMBOL

CONDITIONS

VIN

VUVLO

VIN = VREG = VDREG_ (Note 2)

VIN rising

MIN TYP MAX UNITS

5.5

23.0

V

4.5

5.5

V

3.95 4.05 4.15

V

Input Undervoltage Lockout

Hysteresis

0.35

V

Operating Supply Current

Shutdown Supply Current

REG VOLTAGE REGULATOR

Output-Voltage Setpoint

Load Regulation

VREG

DIGITAL SOFT-START/SOFT-STOP

Soft-Start/Soft-Stop Duration

Reference Voltage Steps

ERROR TRANSCONDUCTANCE AMPLIFIER

FB_, TRACK_ Input Bias Current

FB_ Voltage Setpoint

VFB

VIN = 12V, VFB_ = 0.8V, no switching

VIN = 12V, EN_ = 0V, PGOOD_ unconnected

VIN = 5.5V to 23V

IREG = 0 to 120mA, VIN = 12V

TA = TJ = 0°C to +85°C

TA = TJ = -40°C to +125°C

4.9

-250

0.5945

0.590

5

150

2048

64

0.6

0.6

8

300

5.2

0.2

+250

0.6065

0.608

mA

µA

V

V

Clocks

Steps

nA

V

V

2

Maxim Integrated

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