LX8117 Просмотр технического описания (PDF) - Microsemi Corporation
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LX8117 Datasheet PDF : 11 Pages
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PRODUCT DATABOOK 1996/1997
LX8117-xx/8117A-xx/8117B-xx
0.8, 1 & 1.2A L OW DR O P O U T PO S I T I V E RE G U L AT O R S
PRODUCTION DATA SHEET
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
Power Dissipation .................................................................................. Internally Limited
Input Voltage
LX8117-00/8117A-00/8117B-00 (Adj.) ..................................................................... 15V
LX8117-33/8117A-33/8117B-33 (3.3V), LX8117-05/8117A-05/8117B-05 (5.0V) .... 15V
LX8117-25/8117A-25/8117B-25 (2.5V), LX8117-28/8117A-28/8117B-28 (2.85V) .. 12V
Surge Voltage ............................................................................................................... 15V
Operating Junction Temperature
Plastic (ST, DD & DT Packages) .......................................................................... 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C
Short-Circuit Protection ....................................................................................... Indefinite
RoHS Peak Package Solder Reflow Temp. (40 seconds max. exposure)............................ 260°C (+0, -5)
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of the specified terminal.
T H E R MAL DATA
ST PACKAGE:
THERMAL RESISTANCE-JUNCTION TO TAB, θJT
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
DD PACKAGE:
15°C/W
*150°C/W
THERMAL RESISTANCE-JUNCTION TO TAB, θJT
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
DT PACKAGE:
10°C/W
*60°C/W
THERMAL RESISTANCE-JUNCTION TO TAB, θJC
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
9°C/W
*80°C/W
Junction Temperature Calculation: T = T + (P x θ ). The θ numbers are guidelines for the
J
A
D
JA
JA
thermal performance of the device/pc-board system. All of the above assume no ambient airflow.
* θJAcan be improved with package soldered to 0.5IN2 copper area over backside ground
plane or internal power plane. θJAcan vary from 20ºC/W to > 40ºC/W depending on
mounting technique. (See Application Notes Section: Thermal Considerations)
BLOCK DIAGRAM
PACKAGE PIN OUTS
TAB IS VOUT
3. IN
2. OUT
1. ADJ / GND
ST PACKAGE
(Top View)
TAB IS VOUT
3
2
1
IN
OUT
ADJ / GND
DD PACKAGE (D2 Pak)
(Top View)
TAB IS VOUT
3. IN
2. OUT
1. ADJ / GND
DT PACKAGE (D-Pak)
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
VIN
Bias
Circuit
Thermal
Limit Circuit
Bandgap
Circuit
Control
Circuit
Output
Circuit
VOUT
ADJ
2
Current
Limit Circuit
Copyright © 1999
Rev. 1.5a
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