GLZ5.1C Просмотр технического описания (PDF) - Diotech Company.

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GLZ5.1C

500mW SUFACE MOUNT ZENER DIODE

Diotech Company. 

GLZ2.0 ~ GLZ56

500mW SUFACE MOUNT ZENER DIODE

FEATURES

• Planar Die construction

• 500mW Power Dissipation

• Ideally Suited for Automated Assembly Processes

• Both normal and Pb free product are available :

Normal : 80~95% Sn, 5~20% Pb

Pb free: 98.5% Sn above

MECHANICAL DATA

• Case: Molded Glass MINI-MELF

• Terminals: Solderable per MIL-STD-750, Method 2026

• Polarity: See Diagram Below

• Approx. Weight: 0.03 grams

• Mounting Position: Any

MINI-MELF / LL-34

0.063(1.6)

0.055(1.4) DIA.

0.020(0.5)

0.012(0.3)

0.146(3.7)

0.130(3.3)

0.020(0.5)

0.012(0.3)

Dimensions in inches and (millimeters)

ABSOLUTE MAXIMUM RATINGS(LIMITING VALUES)(TA=25℃ )

Symbols

Zener current see table "Characteristics"

Power dissipation at TA=25℃

Ptot

Junction temperature

TJ

Storage temperature range

T STG

1)Valid provided that at a distance of 8mm from case are kept at ambient temperature

Value

5001)

175

-65 to + 175

Units

mW

℃

℃

ELECTRICAL CHARACTERISTICS(TA=25℃ )

Symbols

Min.

Thermal resistance junction to ambient

R THA

Forward voltage at IF=100mA

VF

1)Valid provided that leads at a distance of 8mm from case are kept at ambient temperature

Typ.

Max.

0.3 1)

1

Units

K /mW

V

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