EHD66764 Просмотр технического описания (PDF) - Hitachi -> Renesas Electronics
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EHD66764 Datasheet PDF : 38 Pages
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HD66764 PAD arrangement
- Chip size : 10.2mm x 3.3mm
- Chip thickness : 550um (typ.)
- PAD coordinates : PAD center
- Coordinate origin : chip center
- Au bump size (PAD number is shown in the
bracket) :
(1) 80um x 80um
DUMMY1(1) to DUMMY13(77)
DUMMY54(118), DUMMY61(301)
(2) 45um x 80um
COM1(300) to COM16(285)
COM161(134)to COM176(119)
DUMMY14(78) to DUMMY53(117)
DUMMY62(302) to DUMMY101(341)
(3)35um x 80um
COM17(284) to COM88(213)
DUMMY55(207) to DUMMY60(212)
COM89(206) to COM160(135)
- Au bump height : 15um (typ.)
HD66764
No.341
No.1
DYMMY1
DUMMY2
DUMMY3
DUMMY4
DUMMY5
RESET
CDA
CCL
CCS
DISPTMG
M
FLM
CL1
DCCLK
VSH
VSH
Vcc
Vcc
Vcc
GND
GND
GMD
VM
VM
VM
VCH
VCH
VCH
VLREF
VREG2
VREGH
VEE
VEE
VEE
VCL
VCL
VCL
DUMMY6
CE-
CE+
DUMMY7
DUMMY8
VLCD
VLCD
VLCD
VLOUT2
VLOUT2
C23-
C23+
C22-
C22+
C21-
C21+
VCI2
VCI2
VCI2
VLOUT1
VLOUT1
C12-
C12+
C11-
C11+
VCI1
VCI1
VCIOUT
VCIOUT
VCIOUT
VREG1
VREGL
TEST3
TEST2
RESET
DUMMY9
DUMMY10
DUMMY11
DUMMY12
DUMMY13
No. 77
No. 78
No.2
No.300
No302
No.301
DUMMY61
COM1
COM2
COM15
COM16
COM17
COM18
HD66764
Y
X
COM87
COM88
DUMMY60
DUMMY59
DUMMY56
DUMMY55
COM89
COM90
Type code
No.76
COM159
COM160
COM161
COM162
No.119
COM175
COM176
DUMMY54
No.118
No.117
3
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