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ACT-SF128K32

High Speed 128Kx32 SRAM / 128Kx32 Flash Multichip Module

Aeroflex Corporation 

ACT-SF128K32 High Speed

128Kx32 SRAM / 128Kx32 Flash

Multichip Module

FEATURES

s 4 – 128K x 8 SRAMs & 4 – 128K x 8 Flash Die

in One MCM

s Access Times of 25ns (SRAM) and 60ns

(Flash) or 35ns (SRAM) and 70ns or

90ns (Flash)

s Organized as 128K x 32 of SRAM and 128K x

32 of Flash Memory with Common Data Bus

s Low Power CMOS

s Input and Output TTL Compatible Design

s MIL-PRF-38534 Compliant MCMs Available

s Decoupling Capacitors and Multiple

Grounds for Low Noise

s Commercial, Industrial and Military

Temperature Ranges

s Industry Standard Pinouts

s TTL Compatible Inputs and Outputs

s Packaging – Hermetic Ceramic

q 66–Lead, PGA-Type, 1.385"SQ x 0.245"max,

Aeroflex code# P3,P7 without/with shoulders

CIRCUIT TECHNOLOGY

www.aeroflex.com

FLASH MEMORY FEATURES

s Sector Architecture (Each Die)

q 8 Equal Sectors of 16K bytes each

q Any combination of sectors can be erased with

one command sequence.

s +5V Programing, +5V Supply

s Embedded Erase and Program Algorithms

s Hardware and Software Write Protection

s Page Program Operation and Internal

Program Control Time.

s 10,000 Erase/Program Cycles

FLEX LAB

ISO

9001

CE R T I F I E D

Block Diagram – PGA Type Package (P3 & P7)

OE

A0–A16

SCE

FCS

FWE1 SWE1

FWE2 SWE2

FWE3 SWE3

FWE4 SWE4

128K X 8 FLASH

128K X 8 SRAM

128K X 8 FLASH

128K X 8 SRAM

128K X 8 FLASH

128K X 8 SRAM

128K X 8 FLASH

128K X 8 SRAM

I/O0-7

I/O8-15

I/O16-23

I/O24-31

PIN DESCRIPTION

I/O0-31

Data I/O

A0–16

Address Inputs

FWE1-4 Flash Write Enables

SWE1-4 SRAM Write Enables

FCE Flash Chip Enable

SCE SRAM Chip Enable

OE

Output Enable

NC

Not Connected

VCC

Power Supply

GND

Ground

eroflex Circuit Technology - Advanced Multichip Modules © SCD3850 REV A 5/20/98

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