STTH108 Просмотр технического описания (PDF) - STMicroelectronics
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STTH108 Datasheet PDF : 5 Pages
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STTH108/A
Fig. 1: Conduction losses versus average current.
P(W)
1.6
1.4
δ = 0.1 δ = 0.2
δ = 0.05
δ = 0.5
1.2
δ=1
1.0
0.8
0.6
0.4
T
0.2
IF(AV)(A)
δ=tp/T
tp
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
Fig. 2: Forward voltage drop versus forward
current.
IFM(A)
100.0
Tj=150°C
(maximum values)
10.0
Tj=150°C
(typical values)
Tj=25°C
(maximum values)
1.0
VFM(V)
0.1
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Fig. 3-1: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4, Lleads = 10mm) (DO-41).
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1 Single pulse
0.0
1.E-01
1.E+00
tp(s)
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
Fig. 3-2: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4) (SMA).
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6 δ = 0.5
0.5
0.4
δ = 0.2
0.3
δ = 0.1
0.2
0.1
Single pulse
0.0
1.E-01
1.E+00
tp(s)
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
Fig. 4-1: Thermal resistance junction to ambient
versus copper surface under each lead (epoxy
printed circuit board FR4, copper thickness: 35µm)
(DO-41).
Rth(j-a)(°C/W)
120
110
100
90
80
70
60
50
40
30
20
10
S(cm²)
0
0
1
2
3
4
5
6
7
8
9
10
Fig. 4-2: Thermal resistance junction to ambient
versus copper surface under each lead (epoxy
printed circuit board FR4, copper thickness: 35µm)
(SMA).
Rth(j-a)(°C/W)
140
130
120
110
100
90
80
70
60
50
40
30
20
10
S(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
3/5
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