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MF-MSMD Просмотр технического описания (PDF) - Unspecified

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Компоненты Описание
Список матч
MF-MSMD Datasheet PDF : 4 Pages
1 2 3 4
Additional Features
Patents pending
MF-MSMD Series - PTC Resettable Fuses
Product Dimensions
Model
MF-MSMD010
MF-MSMD014
MF-MSMD020
MF-MSMD030
MF-MSMD050
MF-MSMD075
MF-MSMD110
MF-MSMD125
MF-MSMD150
MF-MSMD160
MF-MSMD200
MF-MSMD260
A
Min.
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
Max.
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
Packaging: 2000 pcs. per reel.
Min.
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
B
Max.
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
C
Min.
0.56
(0.022)
0.56
(0.022)
0.56
(0.022)
0.56
(0.022)
0.38
(0.015)
0.38
(0.015)
0.38
(0.015)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.25
(0.010)
Max.
0.81
(0.032)
0.81
(0.032)
0.81
(0.032)
0.81
(0.032)
0.62
(0.024)
0.62
(0.024)
0.62
(0.024)
0.48
(0.019)
0.48
(0.019)
0.48
(0.019)
0.48
(0.019)
0.48
(0.019)
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
UNIT = MM
(INCHES)
Top and Bottom View
A
Side View
C
B
D
Recommended Pad Layout
1.5 ± 0.05
(.059 ± .002)
2.70 ± 0.1
(.106 ± .004)
1.5 ± 0.05
(.059 ± .002)
3.2 ± 0.1
(0.126 ± .004)
Terminal material: solder-plated copper
Termination pad solderability: Meets EIA
Specification RS-186-9E, ANSI/J-STD-002
Category 3.
Solder Reflow Recommendations
300
Preheating
Soldering
Cooling
250
200
150
100
50
0
160–220
10–20
120
Time (seconds)
Note:
MF-MSMD models can be wave soldered and reworked.
If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.

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