CS5343-CZZR Просмотр технического описания (PDF) - Cirrus Logic
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CS5343-CZZR Datasheet PDF : 21 Pages
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CS5343/4
7. PACKAGE DIMENSIONS
10LD TSSOP (3 mm BODY) PACKAGE DRAWING (Note 1)
N
E
1 23
TOP VIEW
D
E11
c
A2
A
∝
eb
A1
L
END VIEW
SIDE VIEW
SEATING
PLANE
L1
DIM
A
A1
A2
b
c
D
E
E1
e
L
L1
µ
MIN
--
0
0.0295
0.0059
0.0031
--
--
--
--
0.0157
--
0°
INCHES
MILLIMETERS
NOM
MAX
MIN
--
0.0433
--
--
0.0059
0
--
0.0374
0.75
--
0.0118
0.15
--
0.0091
0.08
0.1181 BSC
--
--
0.1929 BSC
--
--
0.1181 BSC
--
--
0.0197 BSC
--
--
0.0236
0.0315
0.40
0.0374 REF
--
--
--
8°
0°
Controlling Dimension is Millimeters
NOM
--
--
--
--
--
3.00 BSC
4.90 BSC
3.00 BSC
0.50 BSC
0.60
0.95 REF
--
MAX
1.10
0.15
0.95
0.30
0.23
--
--
--
--
0.80
--
8°
Notes:
1. Reference document: JEDEC MO-187
2. D does not include mold flash or protrusions which is 0.15 mm max. per side.
3. E1 does not include inter-lead flash or protrusions which is 0.15 mm max per side.
4. Dimension b does not include a total allowable dambar protrusion of 0.08 mm max.
5. Exceptions to JEDEC dimension.
THERMAL CHARACTERISTICS
Parameter
Symbol
Min
Typ
Max
Allowable Junction Temperature
TJ
-
-
135
Junction to Ambient Thermal Impedance
(4-layer PCB) θJA-4
-
100
-
(2-layer PCB) θJA-2
-
170
-
NOTE
4, 5
2
3
Unit
°C
°C/W
°C/W
20
DS687A4
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