ICS574M Просмотр технического описания (PDF) - Integrated Circuit Systems
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ICS574M Datasheet PDF : 4 Pages
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ICS574
Zero Delay, Low Skew Buffer
Package Outline and Package Dimensions
(For current dimensional specifications, see JEDEC Publication No. 95.)
INDEX
AREA
EH
h x 45°
D
A1
e
C
B
8 pin SOIC
Inches
Symbol Min Max
A 0.0532 0.0688
A1 0.0040 0.0098
B 0.0130 0.0200
C 0.0075 0.0098
D 0.1890 0.1968
E 0.1497 0.1574
e
.050 BSC
H 0.2284 0.2440
h 0.0099 0.0195
L 0.0160 0.0500
Millimeters
Min Max
1.35 1.75
0.10 0.24
0.33 0.51
0.19 0.24
4.80 5.00
3.80 4.00
1.27 BSC
5.80 6.20
0.25 0.50
0.41 1.27
A
L
Ordering Information
OrdePrairnt/OgrIdnefroNrummabteiron
ICS574M
ICS574MT
Marking
ICS574M
ICS574M
Shipping packaging
tubes
tape and reel
Package
8 pin SOIC
8 pin SOIC
Temperature
0-70 °C
0-70 °C
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems,
Incorporated (ICS) assumes no responsibility for either its use or for the infringement of any patents or other rights of third
parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in
normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or
other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the
right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life
support devices or critical medical instruments.
MDS 574 B
4
Revision 051801
Integrated Circuit Systems, Inc. • 525 Race Street • San Jose • CA • 95126 • (408)295-9800 • www.icst.com
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