86130 Просмотр технического описания (PDF) - Intersil
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86130 Datasheet PDF : 11 Pages
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ITF86130SK8T
thermal model or manually utilizing the normalized maximum
transient thermal impedance curve.
Displayed on the curve are RθJA values listed in the
Electrical Specifications table. The points were chosen to
depict the compromise between the copper board area, the
thermal resistance and ultimately the power dissipation,
PDM.
Thermal resistances corresponding to other copper areas
can be obtained from Figure 20 or by calculation using
Equation 2. RθJA is defined as the natural log of the area
times a coefficient added to a constant. The area, in square
inches is the top copper area including the gate and source
pads.
RθJA = 83.2 – 23.6 × ln (Area)
(EQ. 2)
The transient thermal impedance (ZθJA) is also effected by
varied top copper board area. Figure 21 shows the effect of
copper pad area on single pulse transient thermal
impedance. Each trace represents a copper pad area in
square inches corresponding to the descending list in the
graph. Spice and SABER thermal models are provided for
each of the listed pad areas.
Copper pad area has no perceivable effect on transient
thermal impedance for pulse widths less than 100ms. For
pulse widths less than 100ms the transient thermal
impedance is determined by the die and package. Therefore,
CTHERM1 through CTHERM5 and RTHERM1 through
RTHERM5 remain constant for each of the thermal models.
A listing of the model component values is available in
Table 1.
240
RθJA = 83.2 - 23.6*ln(AREA)
200
189oC/W - 0.0115in2
160
152oC/W - 0.054in2
120
80
0.01
0.1
1.0
AREA, TOP COPPER AREA (in2)
FIGURE 20. THERMAL RESISTANCE vs MOUNTING PAD AREA
150
COPPER BOARD AREA - DESCENDING ORDER
0.04 in2
120 0.28 in2
0.52 in2
0.76 in2
90 1.00 in2
60
30
0
10-1
100
101
102
103
t, RECTANGULAR PULSE DURATION (s)
FIGURE 21. THERMAL IMPEDANCE vs MOUNTING PAD AREA
7
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