HMC259 Просмотр технического описания (PDF) - Hittite Microwave

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HMC259

GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 28 - 40 GHz

Hittite Microwave 

v01.0801

MICROWAVE CORPORATION

HMC259

GaAs MMIC SUB-HARMONICALLY

PUMPED MIXER, 28 - 40 GHz

MMIC Assembly Techniques for HMC259

5

Mounting & Bonding Techiniques for Millimeterwave GaAs MMICs

The die should be attached directly to the ground

plane eutectically or with conductive epoxy (see HMC

general Handling, Mounting, Bonding Note).

50 Ohm Microstrip transmission lines on 0.127mm

(5 mil) thick alumina thin film substrates are rec-

ommended for bringing RF to and from the chip

(Figure 1). If 0.254mm (10 mil) thick alumina thin film

substrates must be used, the die should be raised

0.150mm (6 mils) so that the surface of the die is

coplanar with the surface of the substrate. One way

to accomplish this is to attach the 0.102mm (4 mil)

thick die to a 0.150mm (6 mil) thick molybdenum heat

spreader (moly-tab) which is then attached to the

ground plane (Figure 2).

Figure 3: Typical HMC259 Assembly

Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length.

Typical die-to-substrate spacing is 0.076mm (3 mils).

5 - 124

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