XE5620G Просмотр технического описания (PDF) - Xecom

Номер в каталоге

Компоненты Описание

Список матч

XE5620G

Smallest World-Wide 56 KBPS Modem

Xecom 

XE5620G Soldering Instructions

The XE5620G is subject to damage if over-exposed to heat during solder reflow operations. Following the

soldering instructions below will ensure that the process of soldering the module to the board does not damage

the modem. The XE5620G must not be exposed to direct Infrared (IR) heating. If your process includes direct

IR heating, you must shield the XE5620G from the infrared rays.

Maximum Temperature

Maximum Time at 220O C

Maximum Time above Eutectic (180O C)

Maximum Preheat Dwell Time

220O C

20 Seconds

90 Seconds

180 Seconds

Maximum Recommended Solder Temperature Profile

220O C

180O C

150O C

--------------------------------180 sec max ---------------------

-20 sec-

max

----- 90 sec max -----

XECOM

(5)

XE5620G

Share Link: