HPMX-3002/T10 Просмотр технического описания (PDF) - HP => Agilent Technologies

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HPMX-3002/T10

Silicon Bipolar RFIC 900 MHz Driver Amplifier

HP => Agilent Technologies 

HPMX-3002 Test Board Layout

OUT

VCC2

1

POWER

CONTROL

OUT

VCC2

POWER

CONTROL

C

LC

C

IC

HPMX-3002

1

C

H

C

VCC1

IN

HPMX-3002

H

VCC1

IN

Finished board size: 1.5" x 1.5" x 1/32"

Material: 1/32" epoxy/fiberglass, 1 oz.

copper, both sides, tin/lead coating,

both sides.

Note: “.” marks indicate drilling

locations for plated-through via holes

to the groundplane on the bottom

side of the board.

Board layed out for coil-craft #AO3T

8 nH spring-coil inductor.

6-83

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