HCTS646D Просмотр технического описания (PDF) - Intersil

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HCTS646D

Radiation Hardened Octal Bus Transceiver/Register, Three-State

Intersil 

Die Characteristics

DIE DIMENSIONS:

124 x 110 mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS646MS

HCTS646MS

DIR SAB CAB VCC CBA SBA OE

(3)

(2)

(1) (24) (23) (22) (21)

A0 (4)

A1 (5)

A2 (6)

A3 (7)

A4 (8)

(20) B0

(19) B1

(18) B2

(17) B3

(16) B4

A5 (9)

(10)

(11)

(12)

(13)

(14)

A6

A7

GND

B7

B6

(15) B5

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS646 is TA14420A.

Spec Number 518628

715

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