GP200MHS12 Просмотр технического описания (PDF) - Dynex Semiconductor

Номер в каталоге

Компоненты Описание

Список матч

GP200MHS12

Half Bridge IGBT Module

Dynex Semiconductor 

GP200MHS12

PACKAGE DETAILS

For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless

stated otherwise. DO NOT SCALE.

28 ± 0.5

28 ± 0.5

11

10

1

2

3

8

9

3x M6

93 ± 0.3

6

7

4x Fast on

tabs

5

4

8

106 ± 0.8

108 ± 0.8

Nominal weight: 270g

Recommeded fixings for mounting: M6

Recommended mounting torque: 5Nm (44lbs.ins)

Recommended torque for electrical connections (M6): 5Nm (44lbs.ins)

Module outline type code: M

8/10

Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.

www.dynexsemi.com

Share Link: