CS8191XNF16 Просмотр технического описания (PDF) - Cherry semiconductor
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CS8191XNF16 Datasheet PDF : 8 Pages
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Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
Lead Count
16L PDIP (internally fused leads)
20L SOIC (internally fused leads)
Metric
Max Min
19.69 18.67
13.00 12.60
D
English
Max Min
.775 .735
.512 .496
Thermal Data
RQJC
typ
RQJA
typ
16L PDIP*
15
50
*Internally Fused Leads
20L SOIC*
9
55
Plastic DIP (N); 300 mil wide
ûC/W
ûC/W
7.11 (.280)
6.10 (.240)
3.68 (.145)
2.92 (.115)
8.26 (.325)
7.62 (.300)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
REF: JEDEC MS-001
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
D
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
2.49 (.098)
2.24 (.088)
1.27 (.050) BSC
2.65 (.104)
2.35 (.093)
1.27 (.050) 0.32 (.013)
0.40 (.016) 0.23 (.009)
REF: JEDEC MS-013
Ordering Information
Part Number
CS8191XNF16
CS8191XDWF20
CS8191XDWFR20
Description
16L PDIP (internally fused leads)
20L SOIC (internally fused leads)
20L SOIC (internally fused leads)
(tape & reel)
Rev. 3/9/99
0.30 (.012)
D
0.10 (.004)
Cherry Semiconductor Corporation reserves the
right to make changes to the specifications without
notice. Please contact Cherry Semiconductor
Corporation for the latest available information.
8
© 1999 Cherry Semiconductor Corporation
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