HI5735KCB Просмотр технического описания (PDF) - Intersil
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HI5735KCB Datasheet PDF : 11 Pages
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Die Characteristics
DIE DIMENSIONS:
161.5 mils x 160.7 mils x 19 mils ±1 mil
METALLIZATION:
Type: AlSiCu
Thickness: M1 - 8kÅ, M2 - 17kÅ
Metallization Mask Layout
HI5735
PASSIVATION:
Type: Sandwich Passivation Undoped Silicon Glass
(USG) + Nitride
Thickness: USG - 8kÅ, Nitride - 4.2kÅ
Total 12.2kÅ ± +2kÅ
DIE ATTACH:
Silver Filled Epoxy
SUBSTRATE POTENTIAL (POWERED UP):
VEED
HI5735
D8
D9 D10 D11
DGND
D7
D6
D5
D4
D3
D2
D1
D0
CTRL OUT
CTRL IN
RSET
AVEE
IOUT
IOUT
ARTN
CLK DVCC DGND
DVEE
10
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