ES1J Datasheet PDF - Sangdest Microelectronic (Nanjing) Co., Ltd

Features:
• Glass Passivated Die Construction
• Ideally Suited for Automatic Assembly
• Low Forward Overload Drop, High Efficiency
• Surge Overload Rating to 30A Peak
• Low Power Loss
• Super-Fast Recovery Time
• Plastic Case Material has UL Flammability Classification Rating 94V-O
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request