Advance Product Information
June 4, 2004
TGA4517-EPU
Chip Assembly Diagram
Vd
0.01uF
1000pF
1000pF
0.01uF
1000pF
0.01uF
1000pF
RF In
RF Out
1000pF
1000pF
0.01uF
0.01uF
100 Ohm 10uF
.
Vg
1000pF
0.01uF
Vd
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com 9