CRG09 Просмотр технического описания (PDF) - Toshiba
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CRG09 Datasheet PDF : 6 Pages
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rth (j-a) – t
10000
(1) Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: 2 mm × 2 mm
1000
Board thickness: 0.64 mm
(2) Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6 mm × 6 mm
Board thickness: 1.6 mm
100
(2)
(1)
10
1
0.001
0.01
0.1
1
10
Time t (s)
CRG09
100
5
2013-11-01
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