MF1S5009DA4 Просмотр технического описания (PDF) - NXP Semiconductors.

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MF1S5009DA4

Mainstream contactless smart card IC for fast and easy solution development

NXP Semiconductors. 

NXP Semiconductors

MF1S5009

Mainstream contactless smart card IC

8. Chip orientation and bond pad locations

x (μm) y (μm)

Bump size

LA, LB

VSS, TP1, TP2

Chip Step

69

58

1231(1)

69

58

1280(1)

typ. 15.0(1)

min. 5.0

1071.0(2)

typ. 15.0(1)

min. 5.0

TP1 LA

52.3(2)

239.2(2)

1070.0(2)

typ. 36.4(1)(2)

min. 26.4

typ. 36.4(1)(2)

min. 26.4

1280.0(1)

51.3(2)

TP2

VSS

LB 52.9(2)

MF1S5009

Product data sheet

PUBLIC

Y

X

368.7(2)

556.6(2)

807.7(2)

1231.0(1)

Dimensions in μm

(1) The air gap may vary due to varying foil expansion

(2) Measured from outer sealring edge (see detail)

All dimensions in μm

Fig 4. Chip orientation and bond pad locations

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 27 July 2010

189131

001aam201

© NXP B.V. 2010. All rights reserved.

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