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BQ24075RGTT Просмотр технического описания (PDF) - Teccor Electronics

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BQ24075RGTT Datasheet PDF : 53 Pages
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www.ti.com
bq24072, bq24073, bq24074, bq24075, bq24079
SLUS810L – SEPTEMBER 2008 – REVISED JUNE 2018
8.4 Thermal Information
THERMAL METRIC(1)
bq2407x
RGT
UNIT
16 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
44.5
54.2
17.2
°C/W
1.0
17.1
3.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor IC Package Thermal Metrics application report.
8.5 Dissipation Ratings
PACKAGE (1)
RGT (2)
RθJA
39.47 °C/W
RθJC
2.4 °C/W
POWER RATING
TA 25°C
2.3 W
TA = 85°C
225 mW
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. The pad is
connected to the ground plane by a 2 × 3 via matrix.
Copyright © 2008–2018, Texas Instruments Incorporated
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